CN
Current Location: Home > About Us > Production Environment

Production Iine

Production line
Production line
Production line
Production line
Production line
Production line
Production line
Production line
Production line
Production line
Production line
Production line

Production Iine advantage

Screen printing solder paste
Screen printing solder paste

1. Ensure that the solder paste dots on the bottom of the chip are in the same position, and there will be no displacement of the solder paste dots; 2. Ensure that the solder paste amount of each solder paste dot is consistent to avoid the occurrence of the same batch of products. Condition
CCD visual inspection
CCD visual inspection

1. Each key point in the production process is equipped with a CCD visual inspection system, mainly to check the results of the previous production step. If the production results exceed the set range, the system will automatically alarm and remind; 2. Each production line Equipped with 4 sets of CCD visual inspection systems, the branch inspects the four key steps of screen printing solder paste, blue film bonding, chip dispensing, and Clip jumpers to ensure high product consistency.
Blue film solid crystal
Blue film solid crystal

1. The blue film die-bonding process is that the rubber nozzle uses a vacuum to suck the chip, which effectively avoids the chips colliding with each other during the production process and effectively reduces the probability of chip damage; 2. The blue film die-bonding process is orderly. Absorb the chips on the blue film, so the four chips of each device are the closest on the wafer, so as to ensure high consistency of the four chips; 3. The blue film bonding process is to detect the tin through the bonding vision. The bonding position is determined by the method of paste dots, so the blue film bonding process can ensure the accuracy of the bonding position of each chip.
Chip dispensing
Chip dispensing

1. The welding line of our company adopts the "Musashi" brand glue dispenser, which has the advantages of high accuracy and small error rate of continuous operation; 2. The glue dispensing process can ensure the upper layer of the chip of each batch of products The amount of solder paste is highly consistent, which effectively improves the stability of the product; 3. Compared with the adhesive process, the dispensing process avoids direct contact with the chip, and does not cause pressure on the chip during operation, thereby avoiding the possibility of chip damage.
Clip jumper
Clip jumper

1.Clip jumper is packaged by tape and reel, which can effectively avoid the collision and deformation of the jumper welding surface; 2.Clip jumper has a smoother overall design and higher stability than traditional particle jumpers.
Plate type rapid welding furnace
Plate type rapid welding furnace

1. The space in the plate type rapid welding furnace is small and the air content is low, which can effectively reduce the welding void rate. The current welding void rate is less than 8%; 2. Due to the short length of the plate type rapid welding furnace, the interval between the high temperature zone and the low temperature zone is relatively short. Short, the product quickly enters the low temperature area from the high temperature area, which accelerates the rupture of defective chips, which is conducive to the later electrical selection.
Technical Support：WangGuang NetworkCopyright © Huangshan Qimen Xinfei Electronic Technology Development Co., Ltd. all rights reserved.